Publications

Summary: IEEE TCAD (62), DAC (36), ICCAD (41), etc.

Journal & Conference Papers

Accepted

2024

  • [C208] Fangzhou Liu, Zehua Pei, Ziyang Yu, Haisheng Zheng, Zhuolun He, Tinghuan Chen, Bei Yu, “CBTune: Contextual Bandit Tuning for Logic Synthesis”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Valencia, Spain, Mar. 25–27, 2024.

  • [C207] Hongduo Liu, Peiyu Liao, Junhua Huang, Hui-Ling Zhen, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “Parallel Grobner Basis Rewriting and Memory Optimization for Efficient Multiplier Verification”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Valencia, Spain, Mar. 25–27, 2024.

  • [C206] Zhuolun He, Bei Yu, “Large Language Models for EDA: Future or Mirage?”, ACM International Symposium on Physical Design (ISPD), Taipei, Mar. 12–15, 2024. (Invited Paper) (paper)

  • [C205] Yuan Pu, Tinghuan Chen, Zhuolun He, Chen Bai, Haisheng Zheng, Yibo Lin, Bei Yu, “IncreMacro: Incremental Macro Placement Refinement”, ACM International Symposium on Physical Design (ISPD), Taipei, Mar. 12–15, 2024. (Best Paper Award Nomination) (paper)

  • [C204] Yu Zhang, Yuan Pu, Fangzhou Liu, Peiyu Liao, Kaiyuan Chao, Keren Zhu, Yibo Lin, Bei Yu, “Multi-Electrostatics Based Placement for Non-Integer Multiple-Height Cells”, ACM International Symposium on Physical Design (ISPD), Taipei, Mar. 12–15, 2024. (paper)

  • [C203] Shuo Yin, Wenqian Zhao, Li Xie, Hong Chen, Yuzhe Ma, Tsung-Yi Ho, Bei Yu, “FuILT: Full Chip ILT System With Boundary Healing”, ACM International Symposium on Physical Design (ISPD), Taipei, Mar. 12–15, 2024. (paper)

  • [C202] Siting Liu, Jiaxi Jiang, Zhuolun He, Ziyi Wang, Yibo Lin, Bei Yu, Martin Wong, “Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs”, ACM International Symposium on Physical Design (ISPD), Taipei, Mar. 12–15, 2024. (paper)

  • [C201] Guojin Chen, Hao Geng, Bei Yu, David Z. Pan, “Open-Source Differentiable Lithography Imaging Framework”, SPIE Advanced Lithography + Patterning, San Jose, Feb. 25–29, 2024.

  • [C200] Chen Bai, Jianwang Zhai, Yuzhe Ma, Bei Yu, Martin D.F. Wong, “Towards Automated RISC-V Microarchitecture Design with Reinforcement Learning”, AAAI Conference on Artificial Intelligence (AAAI), Vancouver, Feb. 20–27, 2024. (paper)

  • [C199] Xufeng Yao, Fanbin Lu, Yuechen Zhang, Xinyun Zhang, Wenqian Zhao, Bei Yu, “Progressively Knowledge Distillation via Re-parameterizing Diffusion Reverse Process”, AAAI Conference on Artificial Intelligence (AAAI), Vancouver, Feb. 20–27, 2024. (paper)

  • [C198] Haoyuan Wu, Xinyun Zhang, Peng Xu, Peiyu Liao, Xufeng Yao, Bei Yu, “p-Laplacian Adaptation for Generative Pre-trained Vision-Language Models”, AAAI Conference on Artificial Intelligence (AAAI), Vancouver, Feb. 20–27, 2024. (paper) (Oral)

  • [C197] Yu Zhang, Wei Lin, Sisi Chen, Qingyu Song, Jiaxun Lu, Yunfeng Shao, Bei Yu, Hong Xu, “Fed2Com: Towards Efficient Compression in Federated Learning”, IEEE International Conference on Computing, Networking and Communications (ICNC), Hawaii, Feb. 19–22, 2024.

  • [C196] Xingquan Li, Zengrong Huang, Simin Tao, Zhipeng Huang, Chunan Zhuang, Hao Wang, Yifan Li, Yihang Qiu, Guojie Luo, Huawei Li, Haihua Shen, Mingyu Chen, Dongbo Bu, Wenxing Zhu, Ye Cai, Xiaoming Xiong, Ying Jiang, Yi Heng, Peng Zhang, Bei Yu, Biwei Xie, Yungang Bao, “iEDA: An Open-source infrastructure of EDA”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (Invited Paper)

  • [C195] Xingquan Li, Simin Tao, Shijian Chen, Zhisheng Zeng, Zhipeng Huang, Hongxi Wu, Weiguo Li1, Zengrong Huang, Liwei Ni, Xueyan Zhao, He Liu, Shuaiying Long, Ruizhi Liu, Xiaoze Lin, Bo Yang, Fuxing Huang, Zonglin Yang, Yihang Qiu, Zheqing Shao, Jikang Liu, Yuyao Liang, Biwei Xie, Yungang Bao, Bei Yu, “iPD: An Open-source intelligent Physical Design Tool Chain”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (Invited Paper)

  • [C194] Peng Xu, Jintao Li, Tsung-Yi Ho, Bei Yu, Keren Zhu, “Performance-Driven Analog Layout Automation: Current Status and Future Directions”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (Invited Paper)

  • [C193] Shixin Chen, Su Zheng, Chen Bai, Wenqian Zhao, Shuo Yin, Yang Bai, Bei Yu, “SoC-Tuner: An Importance-guided Exploration Framework for DNN-targeting SoC Design”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper)

  • [C192] Haisheng Zheng, Zhuolun He, Fangzhou Liu, Zehua Pei, Bei Yu, “LSTP: A Logic Synthesis Timing Predictor”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper)

  • [C191] Ping Zhang, Pengju Yao, Xingquan Li, Bei Yu, Wenxing Zhu, “V-GR: 3D Global Routing with Via Minimization and Multi-Strategy Rip-up and Rerouting”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper)


2023

  • [C179] Su Zheng, Bei Yu, Martin Wong, “OpenILT: An Open Source Inverse Lithography Technique Framework”, IEEE International Conference on ASIC (ASICON), Nanjing, Oct. 24–27, 2023. (paper) (slides) (Invited Paper)


2022


  • [J71] Martin Rapp, Hussam Amrouch, Yibo Lin, Bei Yu, David Z. Pan, Marilyn Wolf, Jorg Henkel, “MLCAD: A Survey of Research in Machine Learning for CAD”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 10, pp. 3162–3181, 2022. (paper) (Keynote Paper)

  • [J64] Yibo Lin, Xiaohan Gao, Tinghuan Chen, Bei Yu, “Machine learning for digital circuit backend design”, Micro/nano Electronics and Intelligent Manufacturing, vol. 2, no. 3, 2022. (in Chinese) (paper)

  • [J61] Ran Chen, Wei Zhong, Haoyu Yang, Hao Geng, Fan Yang, Xuan Zeng, Bei Yu, “Faster Region-based Hotspot Detection”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 3, pp. 669–680, 2022. (code) (paper)

2021

  • [C118] Tinghuan Chen, Qi Sun, Bei Yu, “Machine Learning in Nanometer AMS Design for Reliability”, IEEE International Conference on ASIC (ASICON), Kunming, China, Oct. 26–29, 2021. (paper) (slides) (Invited Paper)

  • [C116] Wei Li, Guojin Chen, Haoyu Yang, Ran Chen, Bei Yu, “Learning Point Clouds in EDA”, ACM International Symposium on Physical Design (ISPD), Mar. 21–Mar. 24, 2021. (paper) (slides) (Invited Paper)

  • [C111] Hongjia Li, Mengshu Sun, Tianyun Zhang, Olivia Chen, Nobuyuki Yoshikawa, Bei Yu, Yanzhi Wang, Yibo Lin, “Towards AQFP-Capable Physical Design Automation”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Feb. 01–05, 2021. (paper)


  • [J58] Wei Li, Yuzhe Ma, Qi Sun, Lu Zhang, Yibo Lin, Iris Hui-Ru Jiang, Bei Yu, David Z. Pan, “OpenMPL: An Open Source Layout Decomposer”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 40, no. 11, pp. 2331–2344, 2021. (paper)

  • [J56] Guyue Huang, Jingbo Hu, Yifan He, Jialong Liu, Mingyuan Ma, Zhaoyang Shen, Juejian Wu, Yuanfan Xu, Hengrui Zhang, Kai Zhong, Xuefei Ning, Yuzhe Ma, Haoyu Yang, Bei Yu, Huazhong Yang, Yu Wang, “Machine Learning for Electronic Design Automation: A Survey”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 25, no. 5, 2021. (paper)

2020


2019

  • [C80] Bentian Jiang, Xiaopeng Zhang, Ran Chen, Gengjie Chen, Peishan Tu, Wei Li, Evangeline F. Y. Young, Bei Yu, “FIT: Fill Insertion Considering Timing”, ACM/IEEE Design Automation Conference (DAC), pp. 221:1–221:6, Las Vegas, NV, June 2–6, 2019. (paper) (slides) (poster)


2018


2017

  • [C57] Hang Zhang, Fengyuan Zhu, Haocheng Li, Evangeline F. Y. Young, Bei Yu, “Bilinear Lithography Hotspot Detection”, ACM International Symposium on Physical Design (ISPD), pp. 7–14, Portland, OR, Mar. 19–22, 2017. (paper) (Best Paper Award)


2016


2015


2014

2013


2012

  • [C13] Bei Yu, Jhih-Rong Gao, Duo Ding, Yongchan Ban, Jae-Seok Yang, Kun Yuan, Minsik Cho, David Z. Pan, “Dealing with IC Manufacturability in Extreme Scaling”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 240–242, San Jose, Nov. 5–8, 2012. (paper) (Embedded Tutorial paper)


2011

2010

2009



Books / Book Chapters

 

[B4] Haoyu Yang, Yibo Lin, Bei Yu, “Machine Learning for Mask Synthesis and Verification”, in Machine Learning Applications in Electronic Design Automation, Mark Ren eds., Springer, 2022. (paper)

 

[B3] Shiyan Hu, Bei Yu, “Big Data Analytics for Cyber-Physical Systems”, Springer, 2020.

 

[B2] Bei Yu, David Z. Pan, “Design for Manufacturability with Advanced Lithography”, Springer, 2016.

 

[B1] Bei Yu, David Z. Pan, “Layout Decomposition for Triple Patterning”, in Encyclopedia of Algorithms, M.-Y. Kao eds., Springer, 2015. (paper)


Dissertation

Newsletters

  • [N2] Bei Yu, Gilda Garreton, David Z. Pan, “Layout Compliance for Triple Patterning Lithography: An Iterative Approach”, SPIE Newsroom.