Objective
Syllabus
Starting with the introduction of different types of Intellectual Property (IP), such as patents, trademarks, registered design, copyright and trade secret, etc., from legal regulations, going through case studies and the best practices of intellectual property rights (IPR) protection and enforcement, to establish a foundation for the proactive management of IP and commercialization of technologies and innovations.
This course covers the following elements:
Learning Outcome
This course aims to raise awareness of the principal concepts of Intellectual Property Management (IPM) and its importance as a spur to human creativity and the advancement of economic and social development. It also provides explanation on the development and implementation of an IPM strategy including the management of intellectual property (IP) in a company or an organization.
After going through the course, students are able :
Objective
Syllabus
Overview of optical fibre communications. Types and properties of fibres. Optical transmitters, receivers, and repeaters. Passive optical component. Optical modulation and multiplexing techniques. Fibre communication systems. Optical networks. Introduction to optical interconnects. Silicon photonics. Active optical cables. Recent trends in optical interconnects.
Learning Outcome
By the end of the course, students should obtain an overall picture of the history and recent developments of optical communications, and understand its advantages and limitations. They will acquire knowledge on the operating principle and technology of different key components in an optical communication system and optical interconnects. They should be able to apply skills for the design of basic fibre components, systems, and networks and carry out qualitative and quantitative analyses on their performances.
Objective
Review of semiconductor fundamentals; Introduction to organic semiconductors; Applications of organic thin films as active components in optoelectronic devices including; Fabrication methods for flexible electronics; Fundamentals of photo-electric conversion; Basic principles of photovoltaic devices; Introduction to four-generation solar technologies; Light harvesting and management techniques; Applications.
Syllabus
Review of semiconductor fundamentals: electron and hole, Fermi energy, generation and recombination, p-n junction. Introduction to organic semiconductors: morphology, electronic structures, optical and electrical properties. Application of organic thin films: OLEDs, OTFTs, photodetectors and sensors. Fabrication methods for flexible electronics: sputtering, CVD, VPD, inkjet printing, screen printing, etc. Basic principles of photovoltaic devices: absorption, photo-electric conversion, conversion efficiency, loss mechanism, carrier collection, device characterization. Introduction to four generations of solar cell technology: monocrystalline solar cells; thin-film solar cells; dye-sensitized solar cells; organic solar cells. Light harvesting and management techniques. Applications: manufacturing systems, reliability, life-cycle analysis, markets, and policies.
Learning Outcome
By the end of the course, students should be able to
Objective
Syllabus
Comparison between different lighting sources, lighting standards, basics of all-solid-state lamps, solid-state lighting systems, sensor fundamentals, signal conditioning, functional aspects of different sensors, sensor device examples, technology trend and challenges of solid-state lighting and sensor devices.
Learning Outcome
By the end of the course, students should demonstrate the following outcomes:
Objective & Syllabus
This course starts with a review of semiconductor fundamentals such as electron and hole, Fermi energy, carrier generation and recombination, p-n junction, metal-semiconductor Schottky diodes, carrier mobility, effective mass. The course content covers conventional semiconductor properties, namely electronic structures, optical and electrical properties, metal-oxide capacitors, junction field effect transistors (JFET), metal-oxide-semiconductor field transistors (MOSFET), NMOS technology, basic CMOS technology, charge coupled devices and sensors, MOS transistor modeling, simulation, and design, advanced MOS transistors. Fabrication methods for MOSFETs, including sputtering, CVD, VPD, oxidation, ion implantation, etching, photolithography, metallization, silicon wafer fabrication technology, transistor on-wafer test, etc. will be introduced. The course also covers the basic principles of deep submicron devices: down-scaling benefits and rules, current issues and trends, FinFETs; memory devices; RAM and ROM; SOI technology, BiCMOS technology, thin film transistor (TFT), non-volatile memory devices, device characterization. Other topics may include neuromorphic transistors, system on chips (SoCs), electronic packaging technology, fabrication systems, reliability, life-cycle analysis, markets and policies. Students will learn not only the conventional device physics and fabrication technologies, but also the state-of-the-art device technologies.
Learning Outcome
Upon successful completion of the course, students will be able to: